Cypress Semiconductor Perform CY8C24x94 Specifications download pdf (Page 33)

CY8C21123/CY8C21223/CY8C21323

Document Number: 38-12022 Rev. *Y Page 33 of 46

Figure 18. 20-Pin (210-Mil) SSOP

Figure 19. 24-Pin (4 × 4) QFN

Important Note For information on the preferred dimensions for mounting QFN packages, refer the application note,

Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages available at http://www.amkor.com.

Note that pinned vias for thermal conduction are not required for the low power 24, 32, and 48-pin QFN PSoC devices.

51-85077 *E

51-85203 *D

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Cypress Semiconductor Perform CY8C24x94 Specifications Page 33