Cypress Semiconductor CY7C1441AV33 User Manual Page 17

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CY7C1441AV33
CY7C1443AV33
CY7C1447AV33
Document #: 38-05357 Rev. *F Page 16 of 31
Identification Register Definitions
Instruction Field
CY7C1441AV33
(1M x 36)
CY7C1443AV33
(2M x 18)
CY7C1447AV33
(512K x 72) Description
Revision Number (31:29) 000 000 000 Describes the version number.
Device Depth (28:24) 01011 01011 01011 Reserved for Internal Use
Architecture/Memory
Type(23:18)
[12]
000001 000001 000001 Defines memory type and architecture
Bus Width/Density(17:12) 100111 010111 110111 Defines width and density
Cypress JEDEC ID Code (11:1) 00000110100 00000110100 00000110100 Allows unique identification of SRAM
vendor.
ID Register Presence Indicator (0) 1 1 1 Indicates the presence of an ID
register.
Scan Register Sizes
Register Name Bit Size (x36) Bit Size (x18) Bit Size (x18)
Instruction 3 3 3
Bypass 1 1 1
ID 32 32 32
Boundary Scan Order (165-ball FBGA package) 89 89 -
Boundary Scan Order (209-ball FBGA package) - - 138
Identification Codes
Instruction Code Description
EXTEST 000 Captures I/O ring contents.
IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and
TDO. This operation does not affect SRAM operations.
SAMPLE Z 010 Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM output drivers to a High-Z state.
RESERVED 011 Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD 100 Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Does not affect SRAM operation.
RESERVED 101 Do Not Use: This instruction is reserved for future use.
RESERVED 110 Do Not Use: This instruction is reserved for future use.
BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
Note:
12. Bit #24 is “1” in the ID Register Definitions for both 2.5V and 3.3V versions of this device.
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