Cypress Semiconductor CY8C27x43 User Manual download pdf (Page 37)

May 6, 2005 Document No. 38-12012 Rev. *J 37

4. Packaging Information

This chapter illustrates the packaging specifications for the CY8C27x43 PSoC device, along with the thermal impedances for each

package and the typical package capacitance on crystal pins.

Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of

the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at

http://www.cypress.com/support/link.cfm?mr=poddim.

4.1 Packaging Dimensions

Figure 4-1. 8-Lead (300-Mil) PDIP

51-85075 - *A

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Cypress Semiconductor CY8C27x43 User Manual Page 37